Heat Sink for ARTIX7 Fpga, High Performance Maxiflow with Thermal Tape Attachment, Heat Sink for Ki

Heat Sink for ARTIX7 Fpga, High Performance Maxiflow with Thermal Tape Attachment, Heat Sink for Ki. Reference GEM/2026/B/8000999 · Department of Telecommunications (DOT). Provision of Heat Sink for ARTIX7 Fpga, High Performance Maxiflow with Thermal Tape Attachment, Heat Sink for Ki. Quantity: 2400. Procuring authority: ['Department of Telecommunications (DOT)'].

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